iPhone water damage has always been a frustrating and difficult issue for repair technicians. Things can also be much more difficult when it comes with iPhone X/XS/XS Max. What you usually do with iPhone water damage repair? Got your unique repair thoughts? Well, don’t panic! Our iPhone X water damage repair blog today shall definitely enlighten you.
Press the power button to turn on the phone but there is no response at all. Let’s take apart the phone and remove the display assembly first. Connect the battery connector with the DC Power Supply. Current reading on the ammeter jumps to 100mA and then stays still, which is abnormal.
Step 1 Motherboard Separating
Place the motherboard on the specialized Heating Platform. With temperature of the platform reaching the set temperature. Detach the upper layer and the lower layer from the platform with tweezers. The specialized Heating Platform is perfect for iPhone X motherboard separating.
Step 2 Fault Finding
Check the two layers under the Microscope, and we can see nothing goes wrong with the upper layer. Yet areas on the lower layer bear obvious signs of water damage. Let’s clean the motherboard first.
Step 3 Fault Analyzing
Attach the upper layer and the lower layer to the test fixture and get the phone powered on with tweezers. Current reading on the ammeter jumps to 100mA and then stays still, which is abnormal.
Connect the battery connector on the upper layer and powered on. Current reading on the ammeter is normal. Judging by this, the upper layer has nothing to do with the won’t turn on issue and the fault is probably related to the lower layer. So our next move is to further measure the lower layer.
Step 4 Fault Confirming
Run diode mode measurement of capacitors around the moldy IC U3400, and there is no short-circuit problem around U3400. Continue to run diode mode measurement of the third space PCB. The measured value of Pin S30 is 40, which is abnormal. Since Pin S30 is connected directly to Pin L4 of U3400, the fault is probably related to U3400. So the next thing we do is to check U3400.
First, remove U3400 with Hot Air Gun. We can see that U3400 and its bonding pad have mildewed severely. Therefore, we need to replace it with a new IC.
Step 5 Fault Clearing
When cleaning the bonding pad, we find that three components around U3400 have been subjected to different degrees of corrosion. We need to remove the three components one by one and solder new components to corresponding positions. After that, we can move on to IC soldering. Once done, wait for the lower layer to cool for 5 minutes. Again, run diode mode measurement of Pin S30 on the third space PCB. The measured value is 468, which is normal now.
Step 6 Test
Now, attach the upper layer and the lower layer to the test fixture. Current reading on the ammeter is normal this time and the phone turns on normally.
Step 7 Reballing
In this step we will use a very useful tool, known as iPhone X specialized reballing mold. It can help us complete the reballing process perfectly.
Step 8 Motherboard Recombining
With the help of iPhone X specialized Heating Platform, the motherboard recombining process is very easy and efficient. Wait for the motherboard to cool for 10 minutes.
Step 9 Assemble&Test
Now we can assemble the phone and test. Press the power button to turn on the phone. The phone turns on normally. Fault cleared. Warm tips: get the phone full assembled after confirmation of fault clearance. iPhone X won’t turn on caused by water damage fixed perfectly.
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