As we all know, for chip removing during iPad board repair process, hot air gun as the old way can be useful but with a high risk of damaging the board with high temperature. And a damaged board can be a great loss to repair shops, not only in the economic area but also something relating to reputation. That’s when we put up with this completely new machine targeting the situation. REWA CNC Chip Grinding Machine, as a professional IC chip grinding machine, is used to grind and remove a variety of chips without damaging the board. It is not only effective but also multi-functional, which can be a great help on professional repair work.
CNC Chip Grinding Machine Features
Chips are difficult to be removed since solder balls are easily melted while glues are not. With REWA CNC Chip Grinding Machine, chip removing can be quick and safe without damaging the board.
1. Wire Connecting
Connect the USB LPT interface of the controller with Operating PC. Connect the spindle interface of the controller with the grinding machine. Connect the engraving machine interface of the controller with the grinding machine. Connect the Operating PC with the monitor via VGA wire. Connect the water pipe of the grinding machine with the cooling pump.
Wire up the controller, the monitor, the Operating PC, the light lamp. Get the wireless keyboard and mouse prepared. Wire up the cooling pump. Turn on the power switch of the controller. Turn on the power button of the monitor. Turn on the power button of the Operating PC. Turn on the e-stop switch by rotating clockwise.
2. Grinding Preparing
Open the software. On the software interface, click on the left mouse button and select ‘Operation’. Click on the left mouse button and select ‘Move to Reference Point’ (The process goes with the per powering up of the grinding machine).
On the pop-up window, select ‘All Axes’ and wait for the grinding machine to move back to the original position of coordinates. After that, close up the pop-up window. Click and clear numerical value of X-axis and Y-axis.
3. Grinding Demonstrating – iPhone 6 Audio Chip Grinding
In the manual mode, move the milling cutter of the grinding machine to the corresponding chip grinding area by clicking the control button of X-axis and Y-axis.
Put the iPhone 6 logic board on the corresponding iPhone 6 area. Replace with a new milling cutter when needed. Then fix the logic board to the mold.
On the software interface, click on the file icon. On the ‘Open and load’ window, select ‘iPhone 6 Audio. nc’. Then start the Spindle.
In the manual mode, move the milling cutter of the grinding machine to the corresponding audio chip grinding area by clicking the control button of X-axis,Y-axis and Z-axis. Click the ‘start’ icon on the software interface, or click ‘F9’ to start grinding.
Click the ‘stop’ icon on the software interface, or click ‘F11’ to stop grinding. On the blank area of the software interface, click on the right mouse button. On the pop-up window, adjust numerical value of Z-axis based on the actual situation.
After that, click the ‘start’ icon on the software interface, or click ‘F9’ to restart grinding. Once the welding spot comes out, stop the grinding process. Clear up chip residue and clean with PCB cleaner.
Evaluate grinding effect to see if the grinding process is successful.